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来自MSN
11 天
传iPhone 17 Air将有重大突破 不设实体SIM卡槽 机身仅厚5.5mm
分析师郭明𫓹透露,Apple将会在秋季推出全新的iPhone 17 Air,同时会取消现有的Plus款式,这是自iPhone 14系列以来产品线最大变革。这款新机以超薄设计为主打,最薄处仅约5.5mm,并采用eSIM技术取代实体SIM卡槽。 iPhone 17 ...
ZAKER科技 on MSN
12 天
新的“iPhone 17 Air”据称采用超薄 5.5 毫米设计,无 SIM 卡插槽
根据著名苹果供应链分析师郭明琪分享的最新信息,预计今年晚些时候推出的所谓“ iPhone 17 Air ”机型将采用超薄设计,最薄处仅为 5.5 毫米。 郭明琪补充道,这款设备将没有实体 SIM 卡插槽,而是完全依赖数字 eSIM ...
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