Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, ...

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; NVIDIA, AMD export licenses; Cadence's acquisition; DRAM, NAND flash; rare ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure ...

Improved Package Internal Connections: Instead of traditional aluminum wedge bond, utilizing aluminum ribbon bonds, copper ...

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Moving data through a chip or package, and between packages and systems, is becoming a much bigger challenge as the volume of data continues to explode, and as more compute resources are deployed to ...

High-frequency signal conversion Researchers from ETH Zurich developed a plasmonic modulator capable of converting electrical signals into optical signals with a frequency of over a terahertz. The ...

At GTC 2025, Nvidia CEO Jensen Huang projected $1 trillion in global data center CapEx by 2028. At this pace, data center ...

Semiconductor Engineering has compiled a comprehensive list of the types of packages, what’s included in them, and various processes used for assembling them. Included in this report are discussions ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...